Bibo Semiconductor is built from a combined R&D team with decades of experience from top international and leading domestic communications IC design groups. The company reports annual shipment volumes in the hundreds of millions of mobile terminal IC units. Its technology stack covers communication baseband algorithms, SoC architecture, software platforms and RFIC. Product roadmaps target 5G RedCap (R17, R18), eMBB and future communications standards for IoT and vehicle‑to‑everything (V2X) applications. Bibo plans broad product-line coverage and increased shipments across those IoT and automotive connectivity scenarios. The recent financing is intended to support building and完善 the domestic and overseas 5G communications IoT and V2X edge-side ecosystem and to accelerate product expansion.

Total raised

$100M

Funding rounds

1

Latest round

Series A

Latest activity

Feb 2024