brain.space builds a Brain-Data-as-a-Service ecosystem aimed at exclusive generative AI mental modeling and the development of large mental models (LMMs). Its core product offering includes the Brain Sensei Headset, a non-invasive, operable device with 115 dry EEG sensors that requires a roughly 3-minute setup and minimal training. The Brain Sensei operates autonomously and can integrate additional physiological sensors such as eye trackers, ECG and GSR to collect high-resolution brain data and assess mental and cognitive states. Led by CEO Yair Levy, the company positions its platform to standardize brain data for integration with machine learning and human intelligence. Financially, brain.space completed a funding package that includes an $11M Series A and a $3.5M non-dilutive grant from the Israel Innovation Authority. The company intends to use the proceeds to further work on standardized brain data and the development of LMMs. brain.space develops a wireless, user-friendly EEG helmet with 460 sensors designed for automated, gel-free setup and higher-density recordings than traditional EEG systems. The company pairs the headset with a comprehensive software end-to-end stack intended to make brain activity easy to integrate into applications. It has been in development for four years and is just emerging from stealth, with no peer-reviewed documentation yet but initial research collaborations underway with Ben Gurion University’s Department of Cognitive and Brain Science and a medical center in Israel. Target use cases the company is exploring include tracking learning disabilities, markers of cognitive decline such as Alzheimer’s, athletic performance, and telehealth monitoring. Brain.space is also demonstrating the device in space as part of the Axiom-1 mission to collect longitudinal neural data aboard the ISS. The company says headset pricing will vary by application and likely sit between consumer bargain systems and research-grade rigs, though it declined to provide exact figures.

Total raised

$20M

Funding rounds

3

Latest round

Series A

Latest activity

Mar 2025