ChEmpower develops abrasive-free polish pads and chemically reactive chemistry for planarization, offering an alternative to traditional CMP that aims to produce defect-free surfaces and improve chip yields. Its core product set includes polishing pads and chemical solutions designed to create superior planarity without abrasives, demonstrated on an abrasive-free 300mm copper technology. The company has established a pilot line for pad production and announced strategic partnerships with leading semiconductor companies. ChEmpower plans to scale its manufacturing systems, commercialize its product offerings, and recruit engineering, business development, and operations talent to expand market reach. The firm emphasizes sustainability by recovering water used in planarization, addressing an industry issue where up to 40% of fab water usage is tied to the planarization process. ChEmpower raised $18.7M in a Series A to accelerate operations and deployment of its technology across fabs worldwide.

Total raised

$19M

Funding rounds

1

Latest round

Series A

Latest activity

Apr 2025