EnVerv is a fabless semiconductor company headquartered in Milpitas, California, that develops high-performance communications and metering System on Chip (SoC) solutions for Advanced Metering Infrastructure (AMI), smart grid, solar and other grid connectivity markets. Its SoC family comprises single-chip soft-modems supporting ITU-T G.9903 (G3-PLC), ITU-T G.9904 (PRIME), IEEE 1901.2 and IEC-61334 (S-FSK) across CENELEC, FCC and ARIB frequency bands. Target applications include robust, high-speed communications over low-voltage and medium-voltage power lines for AMI, solar micro-inverters, transformer monitoring, substation communications and lighting networks. The company announced the closing of a $15.4 million Series C financing and said it will use the capital to support production ramps, expand its customer base, and continue development of new wired and wireless communications and metering product families. Investors named in the announcement include Cassiopeia Capital Partners, Cisco, UMC Capital and existing backers Benchmark Capital, NEA and Walden International. UMC Capital highlighted confidence in EnVerv's execution in combining complex communication algorithms with high integration to offer low-power, cost-effective single-chip solutions. EnVerv is a fabless semiconductor company that develops high-performance Communications System on Chip (SoC) solutions for the Smart Grid market. Its products are narrowband Power Line Communications (PLC) SoCs that support multiple standards, including G3-PLC, PRIME, S-FSK and EnVerv’s TurboPLC™, and worldwide frequency bands from 10 KHz to 500 KHz. The SoCs enable communications over Low-Voltage (LV) and Medium-Voltage (MV) power lines for applications such as Advanced Metering Infrastructure (AMI), solar inverters, active lighting, industrial control and remote monitoring. EnVerv says its PLC technology has been field trialed worldwide and has received customer acceptance in all major markets. The company is headquartered in San Jose, California, and has offices in San Diego and Shenzhen, China. Management states the new financing will help scale customer support and volume production of its multimode PLC chips.

Total raised

$27M

Funding rounds

2

Latest round

Series C

Latest activity

Mar 2014