Xi'an ESWIN Material develops integrated circuits and provides related solutions as a business unit of Beijing ESWIN Technology Group. The company operates out of Xi'an under its Beijing-based parent group. It focuses on IC design and solutions deployment for semiconductor customers. Recently the firm completed a significant financing round, indicating active capital market interest. The financing will support its ongoing IC and solutions activities as it scales operations. Eswin is a semiconductor company described in the article as a chip maker. It was founded by the boss of Chinese display-technology giant BOE Technology. The company has completed a sizable funding round, raising $283 million. The article links the raise to broader Chinese government efforts to encourage domestic chip production. No product-level details, operating metrics (revenue/users), or future plans were disclosed beyond the fundraising announcement.

Total raised

$747M

Funding rounds

2

Latest round

Series B

Latest activity

Aug 2021