ESWIN Computing
No. 18, Kechuang 10th Street, Beijing Economic and Technological Development Zone, Room 101, Floor 1, Building 3, Yard 18, Beijing, 100176, China
Overview
Beijing Yisiwei Computing Technology Co., Ltd. (奕斯伟计算) designs AIoT chips and end-to-end solutions across computing, connectivity, and display interaction. The company offers chips and solutions for mobile terminals, smart home, smart transportation, and industrial IoT, including multimedia systems, intelligent computing, smart connectivity, display interaction, power management, and automotive systems. It collaborates closely with wafer, packaging/test, and board partners within the Yisiwei Group to accelerate product launches and customer adoption. Market data cited in the article highlights a rapidly growing global AIoT market, supporting strong demand for chip suppliers. Following the recent financing, the company plans to increase R&D investment and expand its team to support continued product and business growth. 奕斯伟计算 (Yisiwei Computing) designs chips and provides solutions across four product categories: display & video, intelligent connectivity, intelligent IoT, and intelligent compute acceleration. Its technology centers on display and video, AI data processing, and wireless connectivity, targeting mobile terminals, smart home, smart transportation, and industrial IoT applications. Several terminal-facing products are already in mass production and have achieved client first shipments. The company says its AI acceleration chip has completed tape-out and is China’s first general parallel compute accelerator based on the RISC‑V architecture. CEO and chairman Wang Dongsheng emphasizes a customer-centric, technology-driven approach. The firm plans to use new funding to support product R&D, IP and tape-out costs, and team expansion to complete its product-line layout and strengthen its ecosystem.
- Total raised
- $675M
- Funding rounds
- 2
- Latest round
- Series C
- Latest activity
- Dec 2021
Industries
- Electronics
- Industrial
- Industrial Engineering
- Information and Communications Technology (ICT)
- Manufacturing
Recent funding
Series C
Dec 2021
$392M
Equity
Jun 2020
$283M
Team
Wang Dongsheng
Founder, Chairman, and CEO