Exnodes develops Computational Parallel InspectionTM technology to enable rapid detection, identification, and root-cause analysis of nanoscale defects in leading-edge semiconductor fabrication. The company leverages breakthroughs in computational optics alongside custom machine learning and image-processing algorithms to improve sensitivity, throughput, and defect classification. Exnodes says its technology is patented and aims to overcome the tradeoff between sensitivity and throughput in wafer inspection systems. Founded in mid-2014 and based in Fremont, California (Silicon Valley), the team comprises inventors, designers, and developers focused on pushing the limits of semiconductor inspection. The company recently closed a $2 million seed round from strategic and angel investors. Proceeds will be used to add expertise and personnel and to deploy R&D infrastructure upgrades to advance product development and address chip and memory yield challenges.

Total raised

$2M

Funding rounds

1

Latest round

Seed

Latest activity

Nov 2016