FLEEP Technologies builds printed electronics and flexible integrated circuits based on carbon‑based polymers rather than silicon. Its technology enables production of flexible circuits via printing techniques (rotogravure, screen printing, inkjet) on substrates such as plastic, paper and fabrics. The startup targets intelligent, flexible and sustainable electronic systems for packaging and biomedical industries. The team is research‑heavy (about 80% hold PhDs) and was founded by the IIT Printed and Molecular Electronics group; it is based at the Center for Nano Science and Technology (CNST) of IIT in Milan and was founded in mid 2019. FLEEP says the new funding will help bring its printed‑electronics technology to market and aims to reach the market within three years. The company recently closed a €900K seed round to support these development plans.

Total raised

$1M

Funding rounds

1

Latest round

Seed

Latest activity

Oct 2020