Future Advanced Technology Research Institute
17th Floor, Joeone International Business Center, No.1, Yilan Road, Xiamen, Fujian, China
Overview
Xi Renma (西人马联合测控(泉州)科技有限公司) is a chip IDM that develops and manufactures high‑precision sensor chips for civil aviation, energy, medical, transportation, and industrial equipment. The company possesses end‑to‑end capabilities including sensor material synthesis, design, manufacturing, packaging, and testing, and reports multiple high‑end industrial sensors in volume production at leading customers. Management says Xi Renma holds over 500 patents, with the patent count growing at roughly 30% per year. Proceeds from the recent strategic financing will be invested in proprietary sensor‑chip R&D, production capacity expansion, and supply‑chain construction to ensure stable delivery of capacity and customer orders. In November 2023 Xi Renma reached a strategic cooperation with the Jiading Anting government to build an 8‑inch sensor and digital electronic chip production line in Shanghai, a project with total investment of RMB 3.6 billion slated to start construction in June 2024 and complete by end‑2025, targeting over RMB 1.5 billion in annual output. Since its founding in March 2017 in Quanzhou, the company has completed seven strategic financing rounds with cumulative financing of about RMB 1 billion.
- Total raised
- $14M
- Funding rounds
- 1
- Latest round
- Equity
- Latest activity
- Mar 2024
Industries
- Electronics
- Manufacturing
- Semiconductor
Recent funding
Equity
Mar 2024
$14M
Team
Nie Yongzhong
Founder and CEO