Hangzhou Garenna Semiconductor focuses on industrialising gallium oxide for semiconductor applications, spanning substrates, epitaxial layers, chip devices and terminal applications. The company plans to support downstream chip customers with device verification services and to establish an end-to-end substrate–epitaxy–device–application chain. Following its Series A raise of several hundred million yuan, it will expand production capacity for 6-inch and 8-inch substrates and epitaxial layers. The funding is aimed at improving manufacturing yields and delivery efficiency to satisfy increasing customer orders. The article does not report revenue, user metrics, or prior funding rounds.

Total raised

$14M

Funding rounds

2

Latest round

Series A

Latest activity

Aug 2024