Halo Industries builds proprietary laser-based tools and processing technologies for semiconductor manufacturing that reduce cost, waste and environmental impact compared with traditional mechanical and thermal methods. Its platform is used to produce advanced materials including silicon carbide (SiC) wafers, and the company says its laser slicing tools significantly increase SiC yield and quality while minimizing waste and production cost. Halo has adapted its process into volume production and serves a growing number of customers across applications such as EVs, charging infrastructure, and grid and industrial uses. The company highlights a robust R&D pipeline and a range of future revenue streams as it scales operations. Halo is scaling commercialization efforts after completing an oversubscribed financing and intends to use the proceeds to expand reach and advance its goal of establishing a new gold-standard for SiC substrate production. The company is based in Santa Clara, Calif., and is led by founder and CEO Andrei Iancu.

Total raised

$80M

Funding rounds

1

Latest round

Series B

Latest activity

Jul 2024