中瓷电子科技 is an electronic-ceramics series products manufacturer engaged in R&D, production and sales. Its main products include semiconductor heating elements and devices, microwave dielectric ceramics and devices, and automotive parts. Product lines cover microwave device packaging, high-density IC packaging, optoelectronic device packaging, MEMS packaging and automotive electronics. The company completed a directed issuance raising about RMB 2.5 billion to support production line construction and R&D investment. The placement involved issuance of 29,940,119 A-shares to seven specific investors, and the gross proceeds were approximately RMB 2.5 billion. After issuance-related fees of RMB 37.3094 million, the net proceeds amounted to RMB 2.463 billion.

Total raised

$343M

Funding rounds

1

Latest round

Equity

Latest activity

Nov 2023