HiSEMICO has developed the first fully automatic electro-plating system dedicated to glass substrates in South Korea and focuses on advanced packaging processes including Through-Glass Via (TGV) and Through-Silicon Via (TSV). The company has already delivered several TGV electro-plating tools to international customers, with those systems running in mass-production for more than four years while maintaining high yield. In 2024 it opened HiSEMICO Semiconductor Technology (Suzhou) Co., which houses China’s first full-process test line for large-format glass substrates up to 510 × 515 mm. The Suzhou site allows joint TGV prototyping and process development with domestic and overseas partners, accelerating localisation of semiconductor plating equipment. HiSEMICO’s R&D roadmap targets next-generation packaging areas such as third-generation semiconductor encapsulation, heterogeneous integration and panel-level packaging, aiming for larger substrate sizes and higher aspect-ratio vias. The newly raised capital will bolster its complete TGV production-line validation capability and expand global R&D, reinforcing its position in the advanced packaging equipment market.

Total raised

$7M

Funding rounds

1

Latest round

Seed

Latest activity

Dec 2025