HPMicro develops high-performance embedded microcontrollers, microprocessors, peripheral chips and supporting development tools and ecosystems. Its mass-produced MCU series include HPM6700/6400, HPM6300, HPM6200, HPM5300 and HPM6800, all AEC‑Q100 certified. The flagship HPM6000-series (HPM6700/6400) uses RISC‑V cores, a company‑developed bus architecture, L1 cache and local memory, achieving up to 816 MHz, over 9000 CoreMark and 4500+ DMIPS. These MCUs support LCD display, audio processing, data forwarding, motor control and other functions for IoT, HMI, smart buildings and smart hardware. HPMicro plans to launch the HPM6E00 series at the end of June, which integrates high-performance motion control with real-time network connectivity for industrial automation and robotic platforms. Founded in June 2020 and headquartered in Shanghai with branches in Tianjin, Suzhou, Shenzhen and Hangzhou, the company reports R&D personnel make up 90% of its team and core members have led over 20 SoC projects. It has accumulated over a thousand customers across industrial, new energy and automotive-electronics sectors and intends to use new funding to expand its product line and market presence.

Total raised

$14M

Funding rounds

1

Latest round

Equity

Latest activity

Jun 2024