Hubei Xingchen develops and operates advanced 3D packaging pilot lines and risk-production platforms aimed at high-density chip integration. The company originated from Jiangcheng Laboratory and rapidly built a Phase I pilot platform in 2024, then completed Phase II equipment installation and commissioning in 2026. Once fully operational, the combined Phase I and II investment exceeds ¥7 billion and is planned to support a monthly capacity of 20,000 wafers, with estimated annual operating revenue of about ¥2.7 billion from R&D and foundry services. The platform can support pilot and risk production of 40–50 chip types and performance validation of 30–40 sets of domestic semiconductor equipment and materials. To date, Hubei Xingchen has promoted pilot production of nearly 30 high-performance chips and provided validation for 35 pieces of domestic equipment. The company partners with equipment manufacturers on joint R&D and rapid commercialization, and received strategic investment including ¥500 million (2024) from investors such as Hubei Jingce Electronic Group. Its stated aim is to become China’s largest and most technologically advanced integrated high-density packaging pilot platform for AI computing, terminal chips, sensing-storage-compute integration, and optoelectronic integration.

Total raised

$5.9B

Funding rounds

1

Latest round

Series A

Latest activity

Jul 2026