HyperLight develops high-performance integrated photonics based on thin-film lithium niobate (TFLN), commercialized as its TFLN Chiplet™ Platform. The platform targets a range of optical interconnect applications including data center pluggables, coherent datacom and telecom modules, and co-packaged optics, and offers products supporting 200G-per-lane operation with 400G-per-lane solutions now sampling. The company emphasizes ultra-high modulation bandwidth, CMOS-level drive voltage, and ultra-low optical loss to reduce power consumption at higher lane speeds. HyperLight has established a strategic manufacturing partnership with UMC and Wavetek for high-volume foundry production on both 6-inch and 8-inch wafers. With the $80 million Series C, the company plans to expand manufacturing capacity, accelerate customer qualification, scale its platform, and deepen partnerships across foundry, semiconductor, networking, and systems integration domains.

Total raised

$117M

Funding rounds

2

Latest round

Series C

Latest activity

Jun 2026