Beijing Qinghe Jingyuan Semiconductor Technology Co., Ltd. develops semiconductor heterogeneous integration technologies, wafer-level bonding substrates, and high-end wafer-bonding equipment. The company has completed R&D and mass production of multiple bonded substrate materials including SiC, LTOI, and LNOI, alongside high-end wafer bonding equipment. It is one of the few global companies that possess a full set of advanced semiconductor materials and heterogeneous integration technologies. Qinghe Jingyuan recently completed a financing round of over RMB 300 million. The company will use the proceeds to expand production — increasing advanced bonding equipment annual capacity to 60 units and building a 400,000-piece 8-inch SiC bonded-substrate line. These moves are intended to accelerate 8-inch SiC substrate mass production, meet growing customer demand, and consolidate its leading position in domestic bonding integration technology.

Total raised

$41M

Funding rounds

1

Latest round

Equity

Latest activity

Jul 2024