KENZO provides "建設PAD" (Kensetsu PAD), a cloud SaaS that injects technology into estimating, procurement and invoicing workflows between construction firms to simplify back‑office work and boost productivity. The product obtained JIIMA certification last year, positioning it to help users comply with the amended electronic ledger preservation law and other legal requirements. KENZO emphasizes close collaboration with customers and aims for the platform to become an industry de facto standard. The company plans to accelerate hiring—particularly engineers—expand product functionality, and grow its customer base. It also plans increased industry outreach via trade shows (including CSPI‑EXPO) and regular user community events at its office. Financially, KENZO completed a ¥170M pre‑Series A and now has cumulative funding of ¥240M to support these expansion efforts.

Total raised

$1M

Funding rounds

1

Latest round

Series A

Latest activity

Apr 2024