Company Details
KoreSemi Technology
Qingdao, Shandong, China
Overview
新核芯科技 is a wafer-level packaging and test service provider. The company says it employs some of the world's most professional semiconductor talent. It provides end-to-end packaging and testing services. The firm completed a RMB100 million equity financing in which Foxconn Industrial Internet participated. Through resources of Hon Hai Technology Group, the company offers comprehensive packaging services.
- Total raised
- $14M
- Funding rounds
- 1
- Latest round
- Equity
- Latest activity
- Mar 2024
Industries
- Application Specific Integrated Circuit (ASIC)
- Manufacturing
- Semiconductor
Recent funding
Equity
Mar 2024
$14M
Team
No current team members are available.