LaserX (镭神技术) develops and sells precision equipment and system-level solutions for optical communications and the semiconductor industry. Its business splits into two lines: back-end precision equipment for optical chips (chip/device testing, aging, die attach, optical path assembly) and back-end equipment for electronic chips focused on precision die bonders and high-speed fully automatic ultrasonic coarse aluminum wire bonders. The company says it will use the new funds for team expansion and product-line development. LaserX was founded in 2017 and operates from Shenzhen. The company’s official website is www.laserx.net. The firm recently completed a B round financing of nearly ¥100 million.

Total raised

$14M

Funding rounds

1

Latest round

Series B

Latest activity

Jan 2024