六方半导体 develops semiconductor thermal-field materials and high-end coating technologies for use in epitaxy. Its main products include SiC coating substrates for LED-chip epitaxy, silicon single-crystal epitaxy substrates, third-generation semiconductor epitaxy substrates and components, and tantalum carbide coatings. These products are widely applied across LED, SiC, GaN, and monocrystalline silicon epitaxy fields. The company recently completed a near‑RMB 100 million Series B financing. Proceeds will be used to accelerate downstream market penetration, further expand production capacity, and iterate on technologies and processes. The firm positions itself to deepen adoption of its coating technologies across downstream semiconductor manufacturing.

Total raised

$14M

Funding rounds

1

Latest round

Series B

Latest activity

Nov 2023