OnScale provides an on-demand, scalable engineering simulation software platform that combines multiphysics solver technology with cloud high-performance computing to handle very large engineering simulation problems. Its CAE tools were architected for highly parallel mainframe-class computing and serve industries including MEMS, semiconductor, 5G, biomedicine, infrastructure safety, and autonomous vehicles. The company was spun out of Thornton Tomasetti in 2017 and is led by CEO Ian Campbell. OnScale’s solutions address simulation needs across semiconductor and MEMS, 5G mobile, next-generation biomedical, infrastructure safety, and autonomous vehicle markets. The company intends to use new funding to drive global expansion, respond to increasing demand, and accelerate development of its CAE solutions for complex, real-world engineering applications. No operating metrics were disclosed in the article. OnScale offers a SaaS platform that combines advanced computer-aided engineering (CAE) multi-physics solvers with a scalable cloud high-performance computing (HPC) environment to accelerate engineering innovation. The company was co-founded by CEO Ian Campbell, VP of Product Development Dr. Robbie Banks, and VP of Engineering Dr. Gerry Harvey as a spin-off from Thornton Tomasetti. OnScale raised $3M in strategic seed funding to scale operations and launch its platform. The funds are intended to support scaling operations and the platform launch, with commercial availability planned for Q2 2018. Initial target markets include 5G (RF filters and switches), IoT/IIoT (microphone arrays, motion/gesture sensors, biometric and fingerprint sensors, industrial sensors), BioMed (advanced therapies, targeted treatment planning, consumer ultrasound), and driverless car sensing technologies (3D ultrasound for object classification and occupant monitoring).

Total raised

$13M

Funding rounds

2

Latest round

Series A

Latest activity

Apr 2019