炬佑智能 is focused on 3D sensing and designs a complete ToF system product line including ToF sensors, VCSEL drivers and 3D ISP. The company says it is currently the only domestic chip maker to achieve ToF sensor mass production and provides end-to-end solutions from chip to application. Its products were introduced across tablets, robots, smart locks, security and IoT in 2020, with those projects slated to enter scale mass production in 2021. 炬佑 has an IC design team whose members come from large foreign chip companies and emphasizes integration across chip, module, algorithm and application layers. Product roadmap in the articles includes a 2021 plan for a million‑level ToF sensor with diamond pixels and a 2022 plan to develop M‑ToF based on small SPAD pixels (<10µm). The company also reports strategic cooperation with a global IC design leader to jointly develop optoelectronic sensing chips.

Total raised

$16M

Funding rounds

1

Latest round

Series B

Latest activity

Dec 2021