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OSMicro

Building D1, East Region 2nd Floor, Intelligent Equipment Science Park, No 3963, Susong Road, Economic and Technological Development District, Hefei, Anhui, 230091, China

Overview

欧思微 develops and sells wireless SoC chips for ultra‑wideband (UWB) and automotive millimeter‑wave radar applications. The company states all core technologies are self‑developed, including RF, baseband, algorithms, protocols, application software, and hardware solutions. It supplies communication and vehicle‑related chips as well as related application technology and system solutions to customers. 欧思微 aims to become a global leading wireless SoC chip supplier. The article reports the company recently completed a nearly ¥100 million Pre‑A financing round; 光源资本 acted as financial advisor for the transaction.

Total raised
$14M
Funding rounds
1
Latest round
Series A
Latest activity
Jan 2024

Industries

  • Automotive
  • Electronics
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Recent funding

  1. Series A

    Jan 2024

    $14M

Team

No current team members are available.