Xingxin is an EDA company focused on physical-design signoff and verification, offering a broad suite of tools including parasitic extraction, power-integrity, electromigration, IR-drop, reliability and multi‑physics analysis. Its flagship GloryEX is a full-chip parameter-extraction solution for FinFET processes and the company says it is the only domestic signoff extraction tool certified for Samsung’s advanced FinFET process. Other products include GloryBolt for EM/IR/reliability analysis and PhyBolt for multi‑physics analysis, and the firm reports its signoff toolchain has begun to take shape. Xingxin serves the global integrated-circuit industry and emphasizes enabling best PPA (power, performance, area) outcomes for customers. The company has R&D centers in Shanghai and Hangzhou and is scaling its team and ecosystem partnerships. Recently it completed a B round financing of over CNY100 million to support R&D, product iteration and recruiting domestic and overseas talent.

Total raised

$16M

Funding rounds

1

Latest round

Series B

Latest activity

Jan 2015