仁芯科技 focuses on developing automotive high-speed communication chips and related solutions. Its product portfolio includes SerDes chips and other offerings for vehicle applications. The company's products support high-speed video and image signal transmission over distances up to 15 meters and provide insertion-loss compensation exceeding 30 dB. The founding team is reported to have extensive chip-industry experience and resources. The company recently completed a nearly RMB 100 million Pre-A++ financing. Investors in the round include 长江中大西威领, 电连晟德创投基金, and 容亿投资.

Total raised

$14M

Funding rounds

1

Latest round

Series A

Latest activity

Apr 2024