Xiwei Technology is a Chongqing-based semiconductor IoT chip solutions provider focused on wireless communication chip R&D and innovation. Its core products include Wi‑Fi6/6E series chips and planned Wi‑Fi7 router chips aimed at consumer electronics and security IoT applications. The company’s first Wi‑Fi6 chip has passed WFA certification and received recognition from multiple Tier‑1 manufacturers. Xiwei recently completed a near‑¥100 million A2 strategic financing, with investors including Yiling Capital and Junshan Capital. The financing will be used to scale mass production and market expansion for the Wi‑Fi6/6E series and to support R&D and industrialization of Wi‑Fi7 router chips. Chongqing Xiwei Technology focuses on domestic development of mid-to-high‑end, high‑rate Wi‑Fi chips for STAs and router APs, with capabilities across algorithm, RF, baseband, SoC design, software and hardware. The company has already mass produced its 1x1 Wi‑Fi6 Combo chip (EA6621), winning volume customers in IPC and tablet segments, and plans to ship a 2x2 Wi‑Fi6/6E Combo series in Q4. Xiwei is actively developing Wi‑Fi7 AP chips, including tape‑out and industrialization efforts, and states it will continue self‑developing core IP across RF, baseband and protocol stacks. Founded just over three years ago and based in Chongqing, the firm assembles a team of executives and senior engineers with experience at domestic and international chip leaders. The company positions its products for smart‑home, smart‑medical, security, education, smart transportation and industrial connectivity scenarios. The newly raised funds are earmarked for volume production and market expansion of current Wi‑Fi6/6E chips and for R&D, tape‑out and industrialization of Wi‑Fi7 router chips.

Total raised

$14M

Funding rounds

2

Latest round

Series A

Latest activity

May 2024