鑫巨半导体 is a supplier of wet‑process equipment for the semiconductor industry, focused on designing,研发 and manufacturing large wet processing tools used in high‑performance integrated circuit and semiconductor packaging substrate production. The company’s core products are large wet processing systems for IC and substrate fabrication. It recently completed a near‑¥100 million Series A financing to support its growth. The financing will be used to industrialize 5–10 micrometer‑level IC substrate production equipment required for advanced packaging. Proceeds will also accelerate domestic advanced‑process equipment R&D, expand the team, and advance market commercialization. The article does not disclose revenues, users, founding year, or location. Xinju (Shenzhen) Semiconductor Technology Co., Ltd. develops high-end IC substrate (IC carrier) production equipment and advanced process technologies, with a technical focus on etch and electroplating. Founded in June 2020 and based in Shenzhen, the company reports nearly six national patents with additional patents pending around etch and plating processes. Its core technical and management team come from international first‑tier firms, and Xinju says it has completed development and internal testing of a 5‑micron line/space process and is working to convert those results into mass‑production equipment. The company plans to offer a series of proprietary lithography process equipment — including dry film development (DDV), flash etch (FET), and dry film stripping (DFS) lines — and to provide process‑enablement services such as etch, plating and cleaning to help customers accelerate manufacturing and ensure yield. Xinju highlights long delivery lead times for substrate equipment and cites rapid domestic demand growth as wafer and chip capacity expands; it projects industry investment in new substrate fabs will exceed RMB 150 billion over the next four years. Financially, the company has completed an angel financing round worth several tens of millions of RMB, with Dongfang Fuhai (SME Development Fund) as the sole disclosed investor.

Total raised

$14M

Funding rounds

2

Latest round

Series A

Latest activity

Nov 2023