芯格诺 is a chip design and R&D company focused on high‑performance mixed‑signal analog‑digital chips with three main product lines: Mini‑LED backlight driver chips, BLDC motor control/drivers, and high‑performance digital power chips. The company emphasizes high‑voltage, high‑performance mixed‑signal design and multi‑product‑line layout, and has shipped over 5 billion chips to date. Recent products include a 4‑channel AM Mini‑LED backlight driver launched for glass‑based Mini‑LED modules and deep collaborations with a domestic display panel leader. Technology highlights include a high‑speed single‑wire communication bus (supporting up to 1 kHz), proprietary mass‑production fault detection, and comprehensive fault protection and voltage feedback to reduce costs and improve yield. 芯格诺 has applied for dozens of invention patents, with several authorized and others filed via PCT, and has established R&D centers in Beijing, Tianjin, Shenzhen, and Silicon Valley. The company plans to use new funding for core technology building, product R&D, development of innovative application scenarios, and business expansion.

Total raised

$15M

Funding rounds

1

Latest round

Series A

Latest activity

Jul 2022