Syenta develops semiconductor packaging technology for the chip industry. The company recently raised $26 million in a funding round backed by a firm led by a former Intel CEO. It is expanding its physical presence by opening a 3,500-square-foot hub in Tempe (East Valley). The article focuses on this U.S. expansion and the new capital but does not provide revenue, user, or broader financial metrics. No founding year or additional operational metrics were included in the coverage. The raise and new facility indicate a move to scale operations and engage more directly with the U.S. market.

Total raised

$39M

Funding rounds

3

Latest round

Series A

Latest activity

Apr 2026