新阳硅密 focuses on research, development, production, sales and after-sales service of semiconductor wet-process electroplating equipment and related wet-process apparatus. The company has independently developed horizontal electroplating equipment, electroless (chemical) plating equipment, cleaning/deglue systems, and liquid supply systems. Its product portfolio is targeted at semiconductor wet-process applications. Recently 新阳硅密 completed a B-round financing of over CN¥100 million. The round was led by Guoxin Investment, with Shanghai Kechuang and the Guomao Industrial Fund participating. No operating metrics or additional strategic plans were disclosed in the article.

Total raised

$14M

Funding rounds

1

Latest round

Series B

Latest activity

Apr 2024