Tessolve offers end-to-end semiconductor and embedded engineering services spanning chip architecture and design through testing, validation, and embedded systems integration. The company works with 90% of the top 20 semiconductor firms and employs over 3,000 engineers across 12 countries, supporting clients in North America, Europe, and Asia. Tessolve has expanded its capabilities via acquisitions such as Germany’s Dream Chip Technologies, adding full-chip turnkey design expertise. The firm plans to use new capital to accelerate R&D, build advanced test labs, expand global delivery centers, and enhance proprietary engineering platforms. Tessolve will also pursue strategic acquisitions to broaden capabilities and enter new markets. Its target verticals include automotive electronics, AI-driven systems, industrial automation, and high-performance computing. Tessolve provides end-to-end engineering services to semiconductor firms, including chip design, test and PCB engineering, product engineering and embedded systems development. It transitioned from a semiconductor test services provider to a full engineering solutions partner with capabilities across Analog, Digital, Mixed Signal and RF. Tessolve reported $75M in 2020 revenue and has delivered year-on-year growth of over 30% since a majority investment by Hero Electronix in 2016. The company employs more than 2,000 people and operates 15 offices across the US, India, Singapore, Malaysia, Europe, the UK and Taiwan, serving marquee customers including eight of the top ten semiconductor companies. Tessolve plans to use new capital to pursue acquisitions and organic investments, strengthen chip design and embedded services and expand its ASIC design business. The company also intends to scale its India operations, invest in local talent development and deepen its presence in key markets across the US, Europe, Southeast Asia, Korea and Japan. Tessolve Services is a full-service semiconductor test and product engineering company based in Bangalore, India. It provides engineering capability across Design for Testability (DFT), package design, test development, characterization and optimized production to lower costs throughout a product's life. The company is equipped with sophisticated test systems and a dedicated engineering team to develop test solutions for RF, advanced mixed-signal, memory and digital devices. Tessolve employs over 400 people. The company has announced it will use new capital from its Series C financing to fund both organic and inorganic growth.

Total raised

$190M

Funding rounds

3

Latest round

Equity

Latest activity

Sep 2025