TopoLogic is a research-driven startup originating from the University of Tokyo that leverages topological materials to tackle computational and thermal challenges. The company aims to commercialize applications that visualize energy and enable energy savings by exploiting unusual electronic band structures. TopoLogic is developing a new MRAM chip called TL-RAM targeting low power consumption and fast write speeds to address rising data-center power use driven by AI. It is also developing a thermal flux sensor, TL-SENSING, which promises ultra-fast response and low cost for heat visualization with applications such as battery anomaly detection and thermal management. The recent fundraising announced provides capital to accelerate these two core projects and further industrial deployment of topological-materials technology.

Total raised

$5M

Funding rounds

1

Latest round

Equity

Latest activity

Feb 2024