Triton Microtechnologies designs and manufactures ultra-thin 2.5D and 3D through-glass-via (TGV) interposers that enable high-density semiconductor packaging. The company combines nMode’s interposer technology with AGC’s glass and via-hole drilling techniques to produce interposers capable of forming thousands of electrical connections between a silicon chip and a printed circuit board. Triton operates a manufacturing facility in Carlsbad, California, using a continuous, high-volume process that drills high-aspect-ratio via holes and fills them with thermally stable copper paste. It makes interposers with via-hole diameters from 70 to 150 microns and thicknesses of 0.7 mm and below, and produces customized solutions for customer applications. Triton states its proprietary technology enables faster cycle times, known-good-die testing at higher packaging integration levels, and the lowest cost per unit in the marketplace. The company plans to use newly triggered funding to further develop and equip its Carlsbad facility to address a critical supply-chain gap for semiconductor packaging.

Total raised

$3M

Funding rounds

1

Latest round

Equity

Latest activity

Oct 2013