Xinshijie Microelectronics designs and mass-produces SPAD-based single-photon dToF one-dimensional and three-dimensional depth-sensing chips and related sensing solutions. The company has a broad product matrix serving consumer devices (robot vacuums, drones, smartphones), AR/VR, smart home, industrial automation and automotive LiDAR use cases. Xinshijie claims industry-leading on-chip integration—combining SPAD pixel arrays, TDCs, DSP/algorithm modules and ultra-low system power—plus proprietary SiP optical packaging and calibration capabilities. Its commercial progress includes tens-of-millions-level chip shipments to top smartphone customers and the first Android deployment of a BSI 3D dToF chip; car-grade VCSEL transmitter drivers and solid-state LiDAR receiver chips are in product validation. The company operates R&D centers in Nanjing, Shanghai and Silicon Valley and holds a broad patent portfolio. Xinshijie recently closed a near-RMB100 million financing and plans to use proceeds for product R&D and market expansion.

Total raised

$14M

Funding rounds

1

Latest round

Series C

Latest activity

Feb 2024