芯芯半导体 develops and manufactures LED semiconductor packaging products, including RGB lighting chips, small‑pitch LED displays, modules, lamp beads and related components. The company’s first phase of an LED packaging production line began commercial production in April of this year. Its planned facility occupies about 18,000 square meters and is equipped with more than 1,300 automated production machines. The full project entails a total planned investment of RMB 1.16 billion to produce RGB lighting chips and display products. Once complete the project is expected to generate annual revenues of about RMB 1.38 billion and annual tax contributions of roughly RMB 65 million. Corporate scope also covers manufacturing of semiconductor device equipment, power electronic components, and display devices. The company was established in 2021 as a joint venture under Sichuan Ningcai Electronic Technology Group and Hong Kong Hisense Ke Electronics.

Total raised

$55M

Funding rounds

1

Latest round

Equity

Latest activity

Nov 2023