Xunlin Technology is a leading domestic provider of glass substrates that has built a full-process factory in Tianjin with an annual capacity of 300,000 square meters covering cutting, thinning, TGV drilling, PVD metallization, plating, structuring and soldermask. The company employs self-developed PVD copper-coating technology and a Cu-ABX four-alloy seed layer, claiming copper adhesion several times higher than the industry average and high-throughput continuous VCP galvanization. Xunlin states it meets three key production indicators—competitive total cost versus comparable PCBs, capability to process thick copper with fine lines, and industry-leading yields—enabling mass-production readiness. Its substrates are already in mass shipment for Mini-LED backlights, COB direct displays and MIP display modules and have been validated by leading domestic customers. The company is expanding along three complementary process platforms to address progressively stricter requirements in hole diameter, density, structure, layer count and line/space precision, targeting higher-end PCB, carrier and interposer applications.

Total raised

$44M

Funding rounds

3

Latest round

Series B

Latest activity

Aug 2026