The company develops high-performance, high-reliability, and cost-effective optoelectronic chips, optical devices, and photonic solutions, with focus areas including optical-electrical integration, silicon photonics, and optoelectronic RF chips. It targets fast-growing Chinese telecom and cloud-computing markets and emphasizes meeting their rapidly rising demand. Investors and company statements note the team’s technical depth and prior delivery of multiple high-speed optoelectronic chip designs with large-scale sales. Management says proceeds will be used to expand production capacity and infrastructure, support product R&D and equipment investment, and accelerate domestic and international business expansion. The company plans to prioritize capacity and quality by expanding production scale and establishing a more complete quality system to ensure high-end, efficient, high-quality delivery. 芯耘光电, founded in 2016, develops 100G‑and‑above silicon photonic chips, photonic integration technology, and related modules for long‑distance electro‑optical transmission. Its main products include long‑reach optical transceiver chips, devices and modules. The company relocated to the Hangzhou Economic Development Zone in April 2017 and focuses on domestic high‑end optoelectronic chip development and localization. Management and technical founders come from leading U.S. and Japanese firms and include experienced chip designers and senior managers. Founder and CEO Xia Xiaoliang and co‑founder Yu Yongrui (PhD in electrical engineering from a University of California school) bring extensive experience in RF/microwave and high‑speed optical communication chip projects, including early 10G/40G/100G designs. The company says the team has strong in‑house R&D capabilities and aims to advance silicon photonics and achieve domestic production of high‑end optical chips.

Total raised

$59M

Funding rounds

2

Latest round

Series B

Latest activity

Sep 2020