篆芯 completed a ¥200 million A2 financing to fund technology R&D and product upgrades. The company focuses on developing high-end network chips and solutions with independent intellectual property, aiming to serve AI, cloud computing and the IoT era. 篆芯's first forthcoming chip, “兰亭” (Lanting), is described as a high-performance, programmable switch suitable for cloud data centers, campus networks and core backbone infrastructure. 篆芯 positions its products against international leading suppliers and proposes open-standard network chips to better serve GPU clusters. The firm says it will continue to focus on core technology innovation, deepen cooperation with industry players, and accelerate roll-out of programmable, large-capacity series chip solutions to meet AI compute cluster bandwidth needs. The company was founded in 2021 and is based in Nanjing.

Total raised

$28M

Funding rounds

1

Latest round

Series A

Latest activity

Mar 2024