The Venture Codex

Participated · Equity · Jul 2026

TYLsemi provides a reusable, standards-based chiplet portfolio—TYL.IO (connectivity), TYL.Power (in-package power delivery), and a planned TYL.Mem family—plus a full-stack TYL.Forge service for custom XPU and fabric designs. The company emphasizes UCIe-based die-to-die connectivity and integration with foundry and packaging partners to accelerate multi-die AI system development. TYLsemi emerged from stealth and raised $43 million in early-stage funding to accelerate product development and commercial engagement. It is partnering with TSMC to deliver IO and power chiplet samples to qualified customers in 2027 and is already engaging lead customers and tier-1 customer engagements that the company says validate its readiness. The firm is expanding its teams across silicon design, packaging, and systems engineering to support market deployment.

Participated · Seed · Jul 2026

U‑ZERO offers an integrated solution for employee engagement combining digital tools, consulting, and empowerment to promote "feedback management" across organizations. The company was founded in 2024 and is headquartered in Otemachi, Chiyoda‑ku, Tokyo. Since launching its service about a year ago, U‑ZERO says it has been adopted by over 50 companies. Its stated mission is to raise Japan's engagement score from 6% in 2024 to 10% by 2030 and ultimately toward the global average of 23%. U‑ZERO will use the recent seed funding to accelerate product development, hire talent to strengthen its organization, and expand sales and marketing. The team is led by CEO and CPO Masamune Mimura, who previously led organizational initiatives at Concur Japan.

Led · Equity · Oct 2023

EdgeCortix develops silicon and software platforms using a patented hardware–software co-design approach to enable energy-efficient, runtime-reconfigurable AI acceleration at the edge. Its technology includes the Dynamic Neural Accelerator® architecture and the MERA software stack, which the company positions for applications across defense, aerospace, smart infrastructure, Industry 4.0, robotics, and telecommunications. EdgeCortix is commercializing next-generation, low-power platforms such as SAKURA-II and the chiplet-based SAKURA-X targeted at Generative and Agentic AI workloads. The company is headquartered in Tokyo and maintains operations in the United States and India. Recent fundraising activity includes an oversubscribed prior round and a subsequent new investment from Axiro Semiconductor and MPower Partners to support further development and commercialization.