Kick Foundation
St. Alban-Vorstadt 12, Basel, Basel-Stadt, 4052, Switzerland
Overview
Kick Foundation offers the value chain as a funnel for entrepreneurship, technology and innovation.
- Total investments
- 3
- Lead investments
- 0
- Investments · 12mo
- 2
- Active investors
- 0
Investment portfolio
- Mosaic SoC
Participated · Seed · Apr 2026
Mosaic SoC develops integrated circuits that process visual and positional sensor data to provide real-time spatial awareness in energy-constrained devices. Its chips use a proprietary multi-core architecture (eight or more cores) engineered to maximize performance per watt compared with single- or dual-core approaches. The company targets applications such as smart glasses, always-on camera tracking in smartphones, and other wearable form factors that require continuous perception without high power draw. Mosaic is building AI deployment toolchains and compilers so firmware developers can leverage its architecture and plans to transition from NRE engineering engagements to product revenues from chip sales. In its first year the company has already secured meaningful revenue through NRE contracts with ODM partners. The company was founded by Moritz Scherer and Alfio Di Mauro, both PhDs from ETH Zurich.
- BTRY
Participated · Seed · Nov 2025
BTRY is a 2023 spinout developing ultrathin thin-film solid-state batteries that replace liquid electrolytes with solid materials to combine energy storage and high power delivery. The company employs a solvent-free vacuum roll-to-roll coating process derived from the semiconductor industry to enable scalable, cost-efficient production. BTRY targets applications across industrial use cases, the Internet of Things, medical technology, and wearable devices. It plans to industrialize its technology and establish what it describes as Europe’s first industrial plant for thin-film solid-state batteries, aiming to produce millions of units per year. The only financial detail reported in the article is the recent €2.2 million EIC Accelerator grant to support those plans.
- Antefil Composite Tech
Participated · Seed · May 2023
Antefil Composite Tech develops patent-pending hybrid glass fibres individually coated with a meltable, recyclable plastic to enable production of lightweight structures for industrial applications. Founded in 2022, the company offers a more cost-efficient and sustainable approach to producing moving lightweight structures. Its technology allows manufacture using minimal pressure and heat, resulting in shorter cycle times and energy savings compared with traditional moulding techniques. The coated fibres enable production of aerospace-quality structures that can be recycled. Antefil intends to accelerate industrial production of its hybrid fibres using proceeds from its recent financing. Nicole Aegerter serves as chairwoman, operational lead and co-founder, and is leading the company’s innovation and material development efforts. Antefil develops micro-engineered hybrid fibers that apply plastic coatings to individual glass reinforcement fibers as they are drawn, eliminating the need for resin infusion and curing. Its process reduces cycle time by up to 35%, ensures uniform fiber distribution and low void content, and yields weldable, recyclable materials. The technology requires only minimal heat and pressure to turn textiles made from these fibers into high-quality structures, enabling faster, higher-volume production. Key target markets include construction, pressure vessels, automotive, aerospace, and wind power, with a combined serviceable market of CHF 20 billion. The team has delivered first samples for material characterization and testing and is seeking collaboration with composite-structure producers. Antefil plans to realize a scaled pilot production plant to supply material for demonstrator projects and initial per-kg sales. The company was founded as a startup project from ETH Zurich by Dr. Christoph Schneeberger, Nicole Aegerter, Prof. Dr. Paolo Ermanni, and Dr. Thomas Billeter.
Team
No current team members are available.