Led · Series C · Sep 2025

Morse Micro is a Sydney-headquartered fabless semiconductor company specializing in Wi-Fi HaLow silicon solutions that offer up to ten times the range and 100 times the coverage area of traditional Wi-Fi, enabling next-generation IoT connectivity for smart homes, industrial automation, and smart cities. Its product line includes the first-generation MM6108 and the newly released MM8108 chips, as well as the HaLowLink 2 global evaluation platform. In 2025 the company launched its second-generation system-on-chip, moved multiple designs into mass production with leading OEMs, and expanded reference designs and ecosystem partnerships. Morse Micro employs more than 130 people in Australia and maintains offices in the United States, Taiwan, China, India, Japan, and the United Kingdom. The firm positions itself at the forefront of “IoT 2.0,” targeting high-throughput, long-range, and highly scalable deployments. To date it has raised over $193 million in venture funding, which is being used to scale chip production and accelerate international expansion. Management asserts an ambition to become the world’s leading wireless IoT chip company and is preparing for future growth and potential public-market entry.

Participated · Series B · Dec 2022

Quadric develops the Chimera GPNPU, a fully programmable general-purpose AI inference processor architecture optimized for on-device AI/ML inference and classic DSP and control algorithms. The Chimera processors scale from 1 to over 3,200 TOPS in multi-chiplet configurations and support both convolutional and transformer-based models, including on-device LLM inference and emerging VLA world models. Quadric's software toolchain converts AI models into C++ and enables SoC teams to program in Python or C++, allowing models to be updated on shipped silicon. The company offers automotive-grade safety-enhanced versions of its architecture and emphasizes a software-updatable approach so the same silicon can run models published after the chip was designed. Quadric reported that product revenues more than tripled in the prior year and that it reached profitability. The company is headquartered in Burlingame, California.

Led · Equity · May 2018

Sckipio Technologies, led by CEO David Baum, is a Ramat Gan, Israel-based provider of Gfast chipsets and develops standards-compliant Gfast modems used to enable ultra-broadband access and mobile backhaul. The company partners with more than 30 companies globally on Gfast and is one of the contributors to the ITU-T standard. It raised $10M in a funding round led by MegaChips, bringing total funding to date to $50M. The round included participation from Intel Capital, Pitango Venture Partners, Genesis Partners, Gemini Israel Ventures, Amiti Ventures, Aviv Ventures, CIRTech Fund and Axess Ventures. Sckipio intends to use the funds for the global rollout of Gfast with tier-1 service providers. Sckipio is a fabless semiconductor company that develops standards-compliant G.fast modems to enable ultra-broadband access and mobile backhaul. The company says it partners with more than 30 companies globally and is a leading contributor to the ITU‑T G.fast standard. Sckipio has delivered several industry firsts, including a 16-port Distribution Point Unit, running UHDTV across G.fast, demonstrating SDN over G.fast with AT&T, and delivering 1Gbps at 300 meters. The company intends to increase technology investments to accelerate innovations in the broadband access market following the new investment. Financially, this financing represents Sckipio’s third round of funding; previously it raised $27 million from Amiti Ventures, Aviv Ventures, Genesis Partners, Gemini Israel Ventures and Pitango Venture Capital. Sckipio was founded in 2012 and is based in Ramat Gan, Israel. Sckipio Technologies develops G.fast modem chipsets and bundles them with software to deliver ultra-broadband over existing copper using Fiber-to-the-distribution-point (FTTdp) architectures. The company provides complete G.fast solutions for access and mobile backhaul based on the ITU G.fast G.9700 and G.9701 standards, to which it is a leading contributor. Sckipio says it intends to extend its leadership in the G.fast market and to scale production to meet rising demand. Management states the additional capital will help the company move faster, enhance its product offering, and provide working capital to scale production. The market for G.fast is cited as expected to reach $2.9B by 2020, underscoring commercial opportunity. Sckipio is backed by venture investors and operates out of Ramat Gan, Israel.