Participated · Series B · Jan 2022

3D Glass Solutions is a U.S.-based maker of glass-ceramic, three-dimensional integrated passive components and system-in-package devices using its patented APEX® photosensitive glass-ceramic technology. The company combines innovative glass process technologies with high-volume semiconductor manufacturing equipment to produce cost-effective, high-precision components for RF, photonic and datacenter applications. Its products offer low loss, high power handling, excellent thermal stability and ultra-low transmission loss across 1–200 GHz, enabling performance not possible with traditional 2D components. 3DGS serves markets including 5G, aerospace, healthcare, autonomous driving, automotive radar, mobile handsets, IoT, and defense. The company reports an ongoing increase in revenue and will use the new funding to expand U.S.-based manufacturing and production wafer capacity and accelerate its product roadmap for 3D heterogeneous integration solutions. It holds foundational patents across materials, design, systems and manufacturing for photosensitive glass-ceramic devices and offers device manufacturing and systems integration services for standard and custom products. 3D Glass Solutions (3DGS) develops and manufactures glass-based 3D passive RF devices and SiP components using its patented low-loss photosensitive APEX® glass-ceramic technology. The company supplies high-precision, high-frequency, low-loss products for automotive radar, IC electronics, medical, aerospace, defense, wireless infrastructure, mobile handset and IoT markets. 3DGS owns foundational patents across materials, design, systems and manufacturing for photosensitive glass-ceramic devices. Recent commercial activity includes a licensing agreement with Corning for through glass vias (TGV) processes in Corning HPFS fused silica and a long-term glass wafer supply agreement with Corning. 3DGS has a long-term supply agreement to provide components to Menlo Microsystems for its Ideal Switch™ as an initial use of the Corning-enabled technology. The company leverages its IP and manufacturing capabilities to expand into adjacent markets enabled by TGV and advanced glass packaging. 3D Glass Solutions fabricates electronic packages and devices using photo-definable, low-loss APEX® glass-ceramic technology to produce glass-based, three-dimensional passive RF components and system-in-package (SiP) devices. Its process yields low RF material loss, ultra-low transmission loss, precise 3D structuring of through-glass vias, and fine-line metallization enabling high interconnect density while minimizing warp. Target end markets include 5G and wireless infrastructure, automotive radar and autonomy, aerospace and defense, medical, mobile handsets and IoT. The company holds foundational patents covering photosensitive glass-ceramic materials, design, systems and manufacturing for glass-ceramic electronic packaging. 3DGS plans to use the Series B1 proceeds to purchase high-volume manufacturing equipment, expand cleanrooms, and increase production, sales management and engineering headcount to support rapidly growing customer demand. Management described the Series B1 as a monumental growth inflection point and part of an aggressive revenue growth strategy focused on transitioning to higher-volume production.