Participated · Equity · Feb 2026

Founded in February 2024, Spirit AI builds vision-language-action foundation models that power general-purpose humanoid robots. Its in-house model drives Moz1, a 26-degree-of-freedom, force-controlled robot already deployed on CATL’s Zhongzhou battery assembly line and in JD.com retail stores for customer interaction and product demonstrations. The company has also open-sourced Spirit v1.5, designed for strong zero-shot task generalization across complex manipulation scenarios. By partnering with manufacturing, logistics and consumer-electronics leaders such as CATL, JD.com, Huawei, Xiaomi and TCL, Spirit AI gains large-scale real-world data to refine its models and accelerate commercial rollout. The latest financing pegs its valuation at roughly ¥10 billion ($1.4 billion), underscoring investor confidence in its embodied AI stack. Although still in early commercialization, the company is rapidly scaling its data pipelines and industrial ecosystem to support broader deployment of humanoid systems.

Led · Series A · Sep 2025

Linkhou Robot has built a comprehensive product matrix of core "eyes" and "limbs" components — including vision modules, joint modules, wheeled robot chassis, smart arms, and domain controllers — aiming to close the hardware loop of perception-decision-execution for embodied intelligence robots. Since 2023 it has aggressively expanded into core components for embodied intelligence while leveraging deep expertise in smart manufacturing. The company operates sci-tech innovation platforms and has established a global production footprint, recently bringing Linkhou Robot Intelligent Technology (Vietnam) Co., Ltd. into production as its first overseas manufacturing base. Its Jiaxing base began production in late May and the Beijing base was expanded to serve as a northern-market development and general-purpose robot mass-production hub. Linkhou plans to upgrade its proprietary smart manufacturing lines and to build Jiangsu province's first provincial laboratory focused on core technologies and components for embodied intelligence robots. The company's recent Series C raise of over 100 million yuan is intended to fund these technical, production, and lab-establishment initiatives.

Participated · Series A · Aug 2025

PaXini develops full-stack embodied perception products—haptic chips, sensors, and multimodal data pipelines—positioning itself as an infrastructure and standards contributor for Physical AI. Over the past year the company reported near-1 million units of self-developed haptic chip consumption, and its multimodal haptic data has been adopted by leading embodied intelligence foundation model companies and major internet technology firms. PaXini says it has achieved product-market fit in the perception track and operates large-scale embodied intelligence data collection factory clusters to produce structured multimodal haptic data. Its core patents reportedly cover major global markets, and the company is building localized operations and delivery systems in North America, Japan, South Korea, and Europe. PaXini's customer matrix has penetrated core global supply chains, and the company emphasizes its role as a foundation for delivering standardized physical interaction data to embodied models. The company aims to scale global commercial deployment and deepen integration with world-class supply chains as it expands internationally.

Participated · Series C · Apr 2023

Founded in 2014, SJSemi focuses on 12-inch mid-end wafer production and end-to-end wafer-level advanced packaging and testing services, including multi-die integration and chiplet solutions. The company serves smartphones, 5G, high-performance computing, data centers, automotive and other electronics markets. SJSemi has invested heavily in R&D, notably debuting a 3x reticle TSV interposer technology in May 2024 and pursuing ultra-high density 3D multi-die integration. According to Yole and CIC Insight Consulting, SJSemi saw top revenue growth among global OSATs in 2023, and ranks No.1 in mainland China for 12-inch bumping, 12-inch WLCSP market share and wafer testing/chip probing revenue. As of 2024 it is the only provider in mainland China capable of mass-producing silicon-based 2.5D packaging solutions. The company is progressing an IPO application and is expanding its one-stop multi-die integration offerings via continued investment. SJ Semiconductor (SJSemi) is a pioneer of 12-inch MEOL foundry services in China, known for high-density bumping, WLCSP and testing. It offers advanced packaging using bumping and RDL technologies, and provides silicon interposer, fan-out wafer and substrate solutions. The company serves IC customers domestically and overseas across smartphones, networking, data center, AI and automotive markets. SJSemi leverages front-end fab management and quality systems to deliver high-performance advanced packaging. Financially, the company has completed a $340M Series C+ tranche that pushes total capital raised above $1 billion and valuation close to $2 billion. Management has indicated it will remain open to additional US dollar funding and will close an RMB tranche after required ODI approvals. SJSemi is a Jiangyin, China-based MEOL foundry founded in August 2014. The company provides Middle-End-Of-Line manufacturing and testing services and develops advanced bumping and 3D Multi-Die Integration technology and solutions. Its core capabilities focus on advanced bumping and 3D multi-die integration for semiconductor packaging. SJSemi closed a $300M Series C that brings its total equity raised to $630M, strengthening its balance sheet. The company says the funding will enable it to continue growing according to its business plan and strengthen its position in advanced packaging. Backers on the round included CMBI, CICC Capital, Oriza Rivertown, Oriza Hua Capital, Walden CEL, CCB PE, CCB Trust, Growth, Country Garden Venture, HTPE, SCGC, CITIC Securities, GP Capital and others.

Participated · Series E · May 2016

Kateeva develops precision deposition equipment for OLED manufacturers. Its core product is the YIELDjet platform, which uses inkjet printing to deposit coatings for mass production of flexible and large-size OLED displays and other products. The company plans to accelerate product development, strengthen customer-satisfaction infrastructure in Asia, and support continued R&D with the new funding. Kateeva maintains operations in Korea, China, Japan and Taiwan and is headquartered in Newark, CA. It has raised $200M to date and recently closed an $88M Series E. Founded in 2008 and led by Chairman and CEO Alain Harrus, Ph.D., the company focuses on scaling manufacturing tools for advanced electronics. Kateeva develops the YIELDjet™ precision deposition platform that uses inkjet printing to mass-produce flexible and large-size OLED panels. The company is building production systems at its Menlo Park facility to fulfill early orders. It intends to use the new funds to support its manufacturing strategy and to expand its global sales and support infrastructure. Kateeva has raised more than $110m in total funding to date. The company was founded in 2008 and is led by CEO Alain Harrus.