Accelsius develops NeuCool, a proprietary two-phase, direct-to-chip liquid-cooling platform that dissipates the extreme heat generated by modern AI and high-performance computing chips. The closed-loop system circulates non-conductive fluids, delivering up to 35% operating-expense savings over single-phase direct-to-chip solutions and 8–17% total cost-of-ownership reductions. With IT racks already reaching 130 kW and air cooling consuming as much as 40 % of data-center power, the company markets its technology as critical infrastructure for emerging gigawatt-scale “AI factories.” Recent traction includes an agreement to deploy NeuCool across DarkNX’s 300 MW campus in Ontario. The newly raised capital will expand production capacity at Accelsius’ Austin facility, accelerate global market entry, and support the rollout of higher-capacity thermal reference designs. Accelsius is a member of NVIDIA’s Inception program and was incubated by venture studio Innventure. Strategic backers Johnson Controls and Legrand give the company access to complementary thermal-management, power-distribution, and data-center infrastructure expertise.

Total raised

$89M

Funding rounds

2

Latest round

Series B

Latest activity

Jan 2026