
Arctic Sand Technologies
25 Burlington Mall Road Suite 416, Burlington, MA, 01803, United States
Overview
Arctic Sand makes power-conversion semiconductors and ICs that aim to deliver significantly more runtime, smaller batteries and thinner smartphones, tablets and Ultrabooks. Its first commercial product is an LED backlight driver IC that increases power conversion efficiency by about 10% in a 33% thinner form factor without increasing circuit board footprint. The company also produces data-center power products that improve server and storage platform power efficiency while occupying up to 50% less space. Arctic Sand targets the $5B DC/DC power conversion market. An MIT spin-out initially funded in January 2013, the company holds 15 issued patents including three exclusively licensed MIT patents co-authored by founder and chief scientist David Guiliano. Arctic Sand is headquartered in Cambridge, MA, with product design centers in Cambridge and Santa Clara and sales/support offices in Silicon Valley and Taiwan, and is led by executives with prior experience building fabless power semiconductor companies. Arctic Sand Technologies is a fabless semiconductor company and MIT spin-off developing the Transformative Integrated Power Solutions (TIPS™) platform for energy-efficient power-conversion chips. The TIPS platform targets DC-to-DC conversion and is designed to cut power-conversion losses by about 50% while offering much smaller solution sizes than competing products. The company positions its technology for telecom, datacom, industrial and mobility markets within a roughly $10 billion total available market for DC-to-DC chips. Arctic Sand says its mission is to reduce global power-conversion inefficiencies that drive electricity costs and oversized power infrastructure; the company cites data centers spending more than $50 billion annually on electricity. Arctic Sand plans to commercialize its platform and scale deployments with the support of both financial and strategic investors.
- Total raised
- $29M
- Funding rounds
- 2
- Latest round
- Series B
- Latest activity
- Feb 2016
Industries
- Electronics
- Hardware
- Semiconductor
Recent funding
Series B
Feb 2016
$19M
Series A
Jan 2013
$10M
Team
No current team members are available.