Arieca develops liquid-metal based thermal interface materials using its patented Liquid Metal Embedded Elastomer (LMEE) technology. Its main products include TIMbber™, an adaptable thermal interface material for semiconductor and power devices, and Thubber®, a soft, stretchable, thermally conductive elastomer. The company targets demanding applications across semiconductor, aerospace, automotive, and healthcare industries. Arieca positions its technology to address rising heat densities as processor node sizes shrink to 7nm, 4nm and below. The firm says its materials combine liquid-metal performance with the manufacturability of thermal greases. Arieca was spun off from Carnegie Mellon University in 2018.

Total raised

$7M

Funding rounds

1

Latest round

Series A

Latest activity

May 2022