Participated · Equity · Nov 2023

SiLC Technologies develops integrated single-chip FMCW (coherent) LiDAR solutions and silicon-photonics-based vision systems for AI-based machine vision. Its flagship products include the 4D+ Eyeonic Chip and the Eyeonic Sensor and Vision System, which the company says deliver long-range, high-precision coherent LiDAR with velocity measurement. SiLC positions FMCW LiDAR as superior to time-of-flight sensors because it resists interference, detects dark or distant objects at up to a kilometer, and measures object velocity to predict movement. The company targets robotics, mobility, perimeter security, industrial automation and other markets and emphasizes low-cost, low-power and scalable silicon photonics for high-volume automotive production. SiLC was founded in 2018 and has been recognized by Frost & Sullivan and Gartner for its 4D LiDAR chip and silicon-photonics innovations. Investors in the company include Dell Technologies Capital, Sony Innovation Fund by IGV, FLUXUNIT – ams OSRAM Ventures, Alter Venture Partners and Epson; a recent investment from Honda is intended to accelerate automotive-focused development. SiLC Technologies develops silicon photonics-based FMCW LiDAR solutions, including its 4D+ Eyeonic Chip and the Eyeonic Vision System, designed to provide coherent machine vision across ranges from short distances to over 1 km. The company has introduced four versions of its FMCW LiDAR-based Eyeonic Vision System and emphasizes AI-driven perception for machines. SiLC says its Eyeonic Chip integrates all photonics functions needed for a coherent vision sensor, offering a tiny footprint with low cost and low power. The new funding will be used to expand production to support design wins and to continue product development and application deployments in mobility, robotics, smart cameras, security, industrial automation, and related markets. SiLC highlights milestones in chip integration, precision, resolution performance, and range detection as drivers of customer engagement. The company was founded in 2018 and is based in Monrovia, California. SiLC Technologies develops silicon-based semiconductor imaging chips and provides development systems for customers in mobility, industrial machine vision, robotics, augmented reality and consumer markets. The company uses a proprietary silicon-based fabrication process and automated IC-style assembly to produce compact solutions. Founded in 2018 by CEO Mehdi Asghari, SiLC is based in Monrovia, California. Over the last year it has supplied development systems to multiple customers across those end markets. The company plans to use new funding to expand operations, accelerate product development and secure additional production design wins ahead of pre-production and product launch activities. Its recent financing brings its total capital raised to support those next-stage commercialization efforts. SiLC Technologies is a developer of integrated single-chip FMCW LiDAR solutions focused on its silicon photonic 4D+ Vision Chip platform. The company’s 4D+ Vision Chip has demonstrated ranges beyond 300 meters and is positioned for a wide range of applications. SiLC uses a proprietary silicon-based semiconductor fabrication process and standard automated IC-style assembly to produce compact, cost-effective, and robust devices. The company plans to scale R&D and operations to further develop its FMCW silicon photonic 4D+ Vision Chip platform. Financially, SiLC closed a $12M seed funding round to support those efforts. SiLC was founded in 2018 by CEO Mehdi Asghari and is based in Monrovia, California.

Participated · Equity · Sep 2022

Ancora Semiconductor is a fabless design company focused on Gallium Nitride (GaN) devices, including GaN discrete components, system-in-package (SiP) and system-on-chip (SoC) products. The company was cultivated under Delta Electronics and was formally founded in 2022 in Taipei. Ancora aims to maximize GaN performance to deliver faster switching, higher efficiency and lower energy consumption across consumer electronics, telecom and automotive applications. Its product line is qualified under Delta's stringent qualification system and the company positions itself to expand production capability to meet growing demand for GaN devices. Ancora announced a NT$456M capital raise from strategic investors intended to accelerate its GaN development endeavors and ecosystem building with partners in substrate materials, IC design, applications and system solutions. As a Delta affiliate, Ancora plans to leverage Delta’s power- and thermal-management expertise to support long-term growth and adoption of GaN technology.

Participated · Series A · May 2022

Arieca develops liquid-metal based thermal interface materials using its patented Liquid Metal Embedded Elastomer (LMEE) technology. Its main products include TIMbber™, an adaptable thermal interface material for semiconductor and power devices, and Thubber®, a soft, stretchable, thermally conductive elastomer. The company targets demanding applications across semiconductor, aerospace, automotive, and healthcare industries. Arieca positions its technology to address rising heat densities as processor node sizes shrink to 7nm, 4nm and below. The firm says its materials combine liquid-metal performance with the manufacturability of thermal greases. Arieca was spun off from Carnegie Mellon University in 2018.