ATLANT 3D uses its direct atomic layer processing (DALP®) technology to place materials precisely at the atomic scale for optics, photonics, microelectronics, quantum computing, sensors and space applications. Its systems create complex structures in a single step, replacing multi-step fabrication and reducing material waste by 90 percent. Since its Series A, the company launched NANOFABRICATOR™ LITE and a prototype multimodular NANOFABRICATOR™ FLOW; the University of Vermont was the first purchaser of the LITE system. ATLANT 3D has established partnerships with over 50 industrial and research organizations, including STMicroelectronics, Sony and several Fortune 500 companies, and expanded its validated materials library to a potential 20 materials. The team has grown to more than 35 members and the company has filed 11 patents, with one granted in the U.S., Singapore, Japan and South Korea. With the Series A+ funding, ATLANT 3D plans to focus on technology leadership, industrial product development, broaden its application portfolio and strategic partnerships, and expand sales, marketing and commercial growth. ATLANT 3D Nanosystems is a Danish deep-tech company founded in 2018 that develops a fundamentally different micro- and nanofabrication platform for atomically precise advanced manufacturing of materials and electronics. Its Nanofabricator combines proprietary hardware and AI to enable direct patterning on complex surfaces, various substrates, wafers, and textured structures, and supports atomically precise processing in micro- and zero-gravity environments. The technology is positioned to replace multi-step cleanroom process flows, reducing processing time and cost from years or months to days while increasing flexibility for material innovation, prototyping, and production of micro- and nanodevices. ATLANT 3D reports it has secured a number of customers since 2020 across space, semiconductor, and electronics industries. The company plans to build a network of advanced manufacturing hubs (A-hubs) globally and to integrate its platform with other advanced technologies to enable a network-centric smart manufacturing infrastructure. The recently raised funding will be used to accelerate technology and product development and support expansion into the company's first international market.

Total raised

$30M

Funding rounds

2

Latest round

Series A

Latest activity

Mar 2025