aveni develops and supplies wet deposition technologies and Electrografting™ chemistries and processes aimed at 2D interconnects and 3D TSV packaging for the semiconductor and electronics industry. The company is led by CEO Bruno Morel and is based in Massy, France. It completed a €8.9M ($10.5M) Series B financing. Backers named in the round include Merck Ventures and existing investors such as Samsung Venture Investment Corporation, Panasonic, ALIAD (Air Liquide Venture Capital), Auriga Partners, Supernova and Idinvest Partners. aveni intends to use the funds to commercialize its technologies. No operating metrics were disclosed in the article. aveni (fka Alchimer S.A.) develops wet electrochemical metallization processes—Electrografting (eG™) for conductive substrates and Chemicalgrafting (cG™) for nonconductive substrates—targeted at damascene, TSVs, MEMS and other electronic applications. The company’s technology enables growth of high‑quality thin films and is currently in the qualification phase for the dual‑damascene process at the 10nm node with three leading logic manufacturers. aveni secured $13.5M in funding to support commercial expansion and technology adoption. It announced formation of a U.S. subsidiary based in Silicon Valley to support the U.S. market. Led by CEO Bruno Morel, the company plans to use the proceeds to grow and expand adoption of its metallization products.

Total raised

$24M

Funding rounds

2

Latest round

Equity

Latest activity

Oct 2017